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Technology License and Development Agreement with ASE

SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its wholly owned subsidiary Invensas Corporation signed a new technology license and development agreement with Advanced Semiconductor Engineering, Inc. ("ASE") (TAIEX:2311, NYSE:ASX), the world’s largest semiconductor assembly and test service provider, to collaborate on the development and commercialization of Invensas Bond Via Array™ (BVA®) technology. ASE will move to the final stage of qualification of Invensas BVA® vertical interconnect technology for Package-on-Package (PoP) applications and begin engaging customers. With Invensas BVA technology, ASE will be able to meet its customers’ desire for low profile and low cost PoP solutions for current and future generations of application processors aimed at smartphones and tablets.

“Tessera is a valued partner for ASE, and we are pleased to expand the technology and business relationship between our two companies”

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Consumer demand for smaller and more advanced mobile electronics creates ever more challenging requirements for chip packaging technologies. Overall package height and assembly cost must be maintained or reduced while accommodating larger and higher performance application processors. Invensas BVA technology enables device manufacturers to address these competing needs, delivering better performance in smaller packages, all while using existing wire bonding manufacturing infrastructure.

“Tessera is a valued partner for ASE, and we are pleased to expand the technology and business relationship between our two companies,” said Tien Wu, Chief Operating Officer of ASE. “The Invensas BVA technology will enable us to deliver advanced packaging solutions that will enable us to continue to satisfy our customers’ requirements for integrated, low profile, cost-effective advanced packaging solutions.”

Invensas BVA technology provides the industry with unmatched tolerance to process variations, which translates into improved yield and cost efficiencies. Further, this technology can be used to provide a cost effective 3D interconnect solution, for System-in-Package (SiP) and a range of other applications.

“We are excited to enter into this agreement with ASE and look forward to continuing to work closely together to proliferate Invensas BVA and future...


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