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Rudolph Acquires Inspection Technology

The following excerpt is from the company's SEC filing.

of Stella Alliance, LLC

Acquired patents to enhance Rudolph’s inspection capabilities in advanced

packaging and extend inspection into new applications

Flanders, New Jersey

(September 29, 2015)-Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has purchased Stella Alliance, LLC, a Massachusetts-based semiconductor inspection technology intellectual property (IP) portfolio company. Stella Alliance’s patented illumination, auto-focus and image acquisition technology significantly enhances the ability to identify certain critical defects not visible with current techniques . With this acquisition, Rudolph expects to add a next-generation, high-resolution inspection system to its portfolio of solutions in the second quarter of 2016. Additionally, the acquired technology is able to handle large rectangular substrates, extending Rudolph’s inspection portfolio footprint into growing unserved segments of microelectronic device manufacturing.

Paul McLaughlin, Rudolph’s chairman and chief executive officer, stated, “We expect the addition of this patented technology to bring a competitive advantage to our customers by addressing current inspection limitations, while helping Rudolph maintain the dominant market share in the back-end inspection arena.”

The technology was developed to overcome the challenges of detecting residue-related defects that traditional technologies can miss. These defects can have a significant impact on the interconnect quality, such as incomplete etch of bond or bump pads, faint copper bridging and stringers at the bottom of vias and high aspect ratio trenches in fan-out wafer level packaging (FOWLP), wafer-level chip scale packaging (WLCSP) and embedded die applications.

In addition, the technology provides the high resolution needed to...