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Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor’s SLIM and SWIFT advanced fan-out package technologies. As a leader in electronic design automation, Cadence will provide Amkor with PADK development support based on the Cadence® Physical Verification System (PVS) software tool. This integrated solution allows Amkor’s customers to shorten the SLIM and SWIFT design and verification cycles.

“Our partnership with Amkor fills a void when it comes to complete sign-off verification for this advanced IC packaging technology, helping to accelerate the adoption of SLIM and SWIFT technologies in this fast growing market segment.”

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“We’re at a critical juncture in the semiconductor industry with increased dependence on packaging solutions for delivery of next-generation products,” said Ron Huemoeller, Amkor’s corporate vice president, research and development. “The development of these PADKs, the latest outcome of our lengthy collaboration with Cadence, addresses a critical gap forming between foundry and back-end-of-line...


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