Actionable news
0
All posts from Actionable news
Actionable news in AMKR: Amkor Technology, Inc.,

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies

TEMPE, Ariz.--(BUSINESS WIRE)--

Amkor Technology, Inc. (AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (CDNS) to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor’s SLIM and SWIFT advanced fan-out package technologies. As a leader in electronic design automation, Cadence will provide Amkor with PADK development support based on the Cadence® Physical Verification System (PVS) software tool. This integrated solution allows Amkor’s customers to shorten the SLIM and SWIFT design and verification cycles.

“We’re at a critical juncture in the semiconductor industry with increased dependence on packaging solutions for delivery of next-generation products,” said Ron Huemoeller, Amkor’s corporate vice president, research and development. “The development of these PADKs, the latest outcome of our lengthy collaboration with Cadence, addresses a critical gap forming between foundry and back-end-of-line, as fan-out packaging solutions blur the lines between these processes. Based on our vast experience with advanced package...


More