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Amkor Technology Takes Leadership Position in Advanced System-in-Package Market

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor packaging and test service provider, today announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications. This achievement establishes Amkor’s leadership in delivering low-cost, high-performance advanced SiP solutions.

“Our broad technology portfolio and engineering talent make Amkor an excellent choice for customers seeking high-performance, miniaturized solutions. In addition to building today’s laminate-based SiPs, we are also developing wafer-level SiP technology to enable the next generation of thinner, higher-performance electronic products.”

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“Reaching this milestone affirms our leadership role in advanced SiP technologies,” said Steve Kelley, CEO and President of Amkor Technology Inc. “Our broad technology portfolio and engineering talent...